drivers/thermal/Kconfig

   1 #
   2 # Generic thermal sysfs drivers configuration
   3 #
   4
   5 menuconfig THERMAL
   6         tristate "Generic Thermal sysfs driver"
   7         help
   8           Generic Thermal Sysfs driver offers a generic mechanism for
   9           thermal management. Usually it's made up of one or more thermal
  10           zone and cooling device.
  11           Each thermal zone contains its own temperature, trip points,
  12           cooling devices.
  13           All platforms with ACPI thermal support can use this driver.
  14           If you want this support, you should say Y or M here.
  15
  16 if THERMAL
  17
  18 config THERMAL_HWMON
  19         bool
  20         prompt "Expose thermal sensors as hwmon device"
  21         depends on HWMON=y || HWMON=THERMAL
  22         default y
  23         help
  24           In case a sensor is registered with the thermal
  25           framework, this option will also register it
  26           as a hwmon. The sensor will then have the common
  27           hwmon sysfs interface.
  28
  29           Say 'Y' here if you want all thermal sensors to
  30           have hwmon sysfs interface too.
  31
  32 config THERMAL_OF
  33         bool
  34         prompt "APIs to parse thermal data out of device tree"
  35         depends on OF
  36         default y
  37         help
  38           This options provides helpers to add the support to
  39           read and parse thermal data definitions out of the
  40           device tree blob.
  41
  42           Say 'Y' here if you need to build thermal infrastructure
  43           based on device tree.
  44
  45 config THERMAL_WRITABLE_TRIPS
  46         bool "Enable writable trip points"
  47         help
  48           This option allows the system integrator to choose whether
  49           trip temperatures can be changed from userspace. The
  50           writable trips need to be specified when setting up the
  51           thermal zone but the choice here takes precedence.
  52
  53           Say 'Y' here if you would like to allow userspace tools to
  54           change trip temperatures.
  55
  56 choice
  57         prompt "Default Thermal governor"
  58         default THERMAL_DEFAULT_GOV_STEP_WISE
  59         help
  60           This option sets which thermal governor shall be loaded at
  61           startup. If in doubt, select 'step_wise'.
  62
  63 config THERMAL_DEFAULT_GOV_STEP_WISE
  64         bool "step_wise"
  65         select THERMAL_GOV_STEP_WISE
  66         help
  67           Use the step_wise governor as default. This throttles the
  68           devices one step at a time.
  69
  70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
  71         bool "fair_share"
  72         select THERMAL_GOV_FAIR_SHARE
  73         help
  74           Use the fair_share governor as default. This throttles the
  75           devices based on their 'contribution' to a zone. The
  76           contribution should be provided through platform data.
  77
  78 config THERMAL_DEFAULT_GOV_USER_SPACE
  79         bool "user_space"
  80         select THERMAL_GOV_USER_SPACE
  81         help
  82           Select this if you want to let the user space manage the
  83           platform thermals.
  84
  85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  86         bool "power_allocator"
  87         select THERMAL_GOV_POWER_ALLOCATOR
  88         help
  89           Select this if you want to control temperature based on
  90           system and device power allocation. This governor can only
  91           operate on cooling devices that implement the power API.
  92
  93 endchoice
  94
  95 config THERMAL_GOV_FAIR_SHARE
  96         bool "Fair-share thermal governor"
  97         help
  98           Enable this to manage platform thermals using fair-share governor.
  99
 100 config THERMAL_GOV_STEP_WISE
 101         bool "Step_wise thermal governor"
 102         help
 103           Enable this to manage platform thermals using a simple linear
 104           governor.
 105
 106 config THERMAL_GOV_BANG_BANG
 107         bool "Bang Bang thermal governor"
 108         default n
 109         help
 110           Enable this to manage platform thermals using bang bang governor.
 111
 112           Say 'Y' here if you want to use two point temperature regulation
 113           used for fans without throttling.  Some fan drivers depend on this
 114           governor to be enabled (e.g. acerhdf).
 115
 116 config THERMAL_GOV_USER_SPACE
 117         bool "User_space thermal governor"
 118         help
 119           Enable this to let the user space manage the platform thermals.
 120
 121 config THERMAL_GOV_POWER_ALLOCATOR
 122         bool "Power allocator thermal governor"
 123         select THERMAL_POWER_ACTOR
 124         help
 125           Enable this to manage platform thermals by dynamically
 126           allocating and limiting power to devices.
 127
 128 config CPU_THERMAL
 129         bool "generic cpu cooling support"
 130         depends on CPU_FREQ
 131         depends on THERMAL_OF
 132         help
 133           This implements the generic cpu cooling mechanism through frequency
 134           reduction. An ACPI version of this already exists
 135           (drivers/acpi/processor_thermal.c).
 136           This will be useful for platforms using the generic thermal interface
 137           and not the ACPI interface.
 138
 139           If you want this support, you should say Y here.
 140
 141 config CLOCK_THERMAL
 142         bool "Generic clock cooling support"
 143         depends on COMMON_CLK
 144         depends on PM_OPP
 145         help
 146           This entry implements the generic clock cooling mechanism through
 147           frequency clipping. Typically used to cool off co-processors. The
 148           device that is configured to use this cooling mechanism will be
 149           controlled to reduce clock frequency whenever temperature is high.
 150
 151           If you want this support, you should say Y here.
 152
 153 config THERMAL_EMULATION
 154         bool "Thermal emulation mode support"
 155         help
 156           Enable this option to make a emul_temp sysfs node in thermal zone
 157           directory to support temperature emulation. With emulation sysfs node,
 158           user can manually input temperature and test the different trip
 159           threshold behaviour for simulation purpose.
 160
 161           WARNING: Be careful while enabling this option on production systems,
 162           because userland can easily disable the thermal policy by simply
 163           flooding this sysfs node with low temperature values.
 164
 165 config IMX_THERMAL
 166         tristate "Temperature sensor driver for Freescale i.MX SoCs"
 167         depends on CPU_THERMAL
 168         depends on MFD_SYSCON
 169         depends on OF
 170         help
 171           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
 172           It supports one critical trip point and one passive trip point.  The
 173           cpufreq is used as the cooling device to throttle CPUs when the
 174           passive trip is crossed.
 175
 176 config SPEAR_THERMAL
 177         bool "SPEAr thermal sensor driver"
 178         depends on PLAT_SPEAR
 179         depends on OF
 180         help
 181           Enable this to plug the SPEAr thermal sensor driver into the Linux
 182           thermal framework.
 183
 184 config ROCKCHIP_THERMAL
 185         tristate "Rockchip thermal driver"
 186         depends on ARCH_ROCKCHIP
 187         depends on RESET_CONTROLLER
 188         help
 189           Rockchip thermal driver provides support for Temperature sensor
 190           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
 191           trip point. Cpufreq is used as the cooling device and will throttle
 192           CPUs when the Temperature crosses the passive trip point.
 193
 194 config RCAR_THERMAL
 195         tristate "Renesas R-Car thermal driver"
 196         depends on ARCH_SHMOBILE || COMPILE_TEST
 197         depends on HAS_IOMEM
 198         help
 199           Enable this to plug the R-Car thermal sensor driver into the Linux
 200           thermal framework.
 201
 202 config KIRKWOOD_THERMAL
 203         tristate "Temperature sensor on Marvell Kirkwood SoCs"
 204         depends on MACH_KIRKWOOD
 205         depends on OF
 206         help
 207           Support for the Kirkwood thermal sensor driver into the Linux thermal
 208           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
 209
 210 config DOVE_THERMAL
 211         tristate "Temperature sensor on Marvell Dove SoCs"
 212         depends on ARCH_DOVE || MACH_DOVE
 213         depends on OF
 214         help
 215           Support for the Dove thermal sensor driver in the Linux thermal
 216           framework.
 217
 218 config DB8500_THERMAL
 219         bool "DB8500 thermal management"
 220         depends on ARCH_U8500
 221         default y
 222         help
 223           Adds DB8500 thermal management implementation according to the thermal
 224           management framework. A thermal zone with several trip points will be
 225           created. Cooling devices can be bound to the trip points to cool this
 226           thermal zone if trip points reached.
 227
 228 config ARMADA_THERMAL
 229         tristate "Armada 370/XP thermal management"
 230         depends on ARCH_MVEBU
 231         depends on OF
 232         help
 233           Enable this option if you want to have support for thermal management
 234           controller present in Armada 370 and Armada XP SoC.
 235
 236 config TEGRA_SOCTHERM
 237         tristate "Tegra SOCTHERM thermal management"
 238         depends on ARCH_TEGRA
 239         help
 240           Enable this option for integrated thermal management support on NVIDIA
 241           Tegra124 systems-on-chip. The driver supports four thermal zones
 242           (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
 243           zones to manage temperatures. This option is also required for the
 244           emergency thermal reset (thermtrip) feature to function.
 245
 246 config DB8500_CPUFREQ_COOLING
 247         tristate "DB8500 cpufreq cooling"
 248         depends on ARCH_U8500
 249         depends on CPU_THERMAL
 250         default y
 251         help
 252           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
 253           bound to thermal zone trip points. When a trip point reached, the
 254           bound cpufreq cooling device turns active to set CPU frequency low to
 255           cool down the CPU.
 256
 257 config INTEL_POWERCLAMP
 258         tristate "Intel PowerClamp idle injection driver"
 259         depends on THERMAL
 260         depends on X86
 261         depends on CPU_SUP_INTEL
 262         help
 263           Enable this to enable Intel PowerClamp idle injection driver. This
 264           enforce idle time which results in more package C-state residency. The
 265           user interface is exposed via generic thermal framework.
 266
 267 config X86_PKG_TEMP_THERMAL
 268         tristate "X86 package temperature thermal driver"
 269         depends on X86_THERMAL_VECTOR
 270         select THERMAL_GOV_USER_SPACE
 271         default m
 272         help
 273           Enable this to register CPU digital sensor for package temperature as
 274           thermal zone. Each package will have its own thermal zone. There are
 275           two trip points which can be set by user to get notifications via thermal
 276           notification methods.
 277
 278 config INTEL_SOC_DTS_THERMAL
 279         tristate "Intel SoCs DTS thermal driver"
 280         depends on X86 && IOSF_MBI
 281         help
 282           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
 283           temperature sensor (DTS). These SoCs have two additional DTSs in
 284           addition to DTSs on CPU cores. Each DTS will be registered as a
 285           thermal zone. There are two trip points. One of the trip point can
 286           be set by user mode programs to get notifications via Linux thermal
 287           notification methods.The other trip is a critical trip point, which
 288           was set by the driver based on the TJ MAX temperature.
 289
 290 config INT340X_THERMAL
 291         tristate "ACPI INT340X thermal drivers"
 292         depends on X86 && ACPI
 293         select THERMAL_GOV_USER_SPACE
 294         select ACPI_THERMAL_REL
 295         select ACPI_FAN
 296         help
 297           Newer laptops and tablets that use ACPI may have thermal sensors and
 298           other devices with thermal control capabilities outside the core
 299           CPU/SOC, for thermal safety reasons.
 300           They are exposed for the OS to use via the INT3400 ACPI device object
 301           as the master, and INT3401~INT340B ACPI device objects as the slaves.
 302           Enable this to expose the temperature information and cooling ability
 303           from these objects to userspace via the normal thermal framework.
 304           This means that a wide range of applications and GUI widgets can show
 305           the information to the user or use this information for making
 306           decisions. For example, the Intel Thermal Daemon can use this
 307           information to allow the user to select his laptop to run without
 308           turning on the fans.
 309
 310 config ACPI_THERMAL_REL
 311         tristate
 312         depends on ACPI
 313
 314 menu "Texas Instruments thermal drivers"
 315 source "drivers/thermal/ti-soc-thermal/Kconfig"
 316 endmenu
 317
 318 menu "Samsung thermal drivers"
 319 depends on ARCH_EXYNOS
 320 source "drivers/thermal/samsung/Kconfig"
 321 endmenu
 322
 323 menu "STMicroelectronics thermal drivers"
 324 depends on ARCH_STI && OF
 325 source "drivers/thermal/st/Kconfig"
 326 endmenu
 327
 328 config QCOM_SPMI_TEMP_ALARM
 329         tristate "Qualcomm SPMI PMIC Temperature Alarm"
 330         depends on OF && SPMI && IIO
 331         select REGMAP_SPMI
 332         help
 333           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
 334           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
 335           trip points. The temperature reported by the thermal sensor reflects the
 336           real time die temperature if an ADC is present or an estimate of the
 337           temperature based upon the over temperature stage value.
 338
 339 endif