drivers/thermal/Kconfig

   1 #
   2 # Generic thermal sysfs drivers configuration
   3 #
   4
   5 menuconfig THERMAL
   6         tristate "Generic Thermal sysfs driver"
   7         help
   8           Generic Thermal Sysfs driver offers a generic mechanism for
   9           thermal management. Usually it's made up of one or more thermal
  10           zone and cooling device.
  11           Each thermal zone contains its own temperature, trip points,
  12           cooling devices.
  13           All platforms with ACPI thermal support can use this driver.
  14           If you want this support, you should say Y or M here.
  15
  16 if THERMAL
  17
  18 config THERMAL_HWMON
  19         bool
  20         prompt "Expose thermal sensors as hwmon device"
  21         depends on HWMON=y || HWMON=THERMAL
  22         default y
  23         help
  24           In case a sensor is registered with the thermal
  25           framework, this option will also register it
  26           as a hwmon. The sensor will then have the common
  27           hwmon sysfs interface.
  28
  29           Say 'Y' here if you want all thermal sensors to
  30           have hwmon sysfs interface too.
  31
  32 config THERMAL_OF
  33         bool
  34         prompt "APIs to parse thermal data out of device tree"
  35         depends on OF
  36         default y
  37         help
  38           This options provides helpers to add the support to
  39           read and parse thermal data definitions out of the
  40           device tree blob.
  41
  42           Say 'Y' here if you need to build thermal infrastructure
  43           based on device tree.
  44
  45 config THERMAL_WRITABLE_TRIPS
  46         bool "Enable writable trip points"
  47         help
  48           This option allows the system integrator to choose whether
  49           trip temperatures can be changed from userspace. The
  50           writable trips need to be specified when setting up the
  51           thermal zone but the choice here takes precedence.
  52
  53           Say 'Y' here if you would like to allow userspace tools to
  54           change trip temperatures.
  55
  56 choice
  57         prompt "Default Thermal governor"
  58         default THERMAL_DEFAULT_GOV_STEP_WISE
  59         help
  60           This option sets which thermal governor shall be loaded at
  61           startup. If in doubt, select 'step_wise'.
  62
  63 config THERMAL_DEFAULT_GOV_STEP_WISE
  64         bool "step_wise"
  65         select THERMAL_GOV_STEP_WISE
  66         help
  67           Use the step_wise governor as default. This throttles the
  68           devices one step at a time.
  69
  70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
  71         bool "fair_share"
  72         select THERMAL_GOV_FAIR_SHARE
  73         help
  74           Use the fair_share governor as default. This throttles the
  75           devices based on their 'contribution' to a zone. The
  76           contribution should be provided through platform data.
  77
  78 config THERMAL_DEFAULT_GOV_USER_SPACE
  79         bool "user_space"
  80         select THERMAL_GOV_USER_SPACE
  81         help
  82           Select this if you want to let the user space manage the
  83           platform thermals.
  84
  85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  86         bool "power_allocator"
  87         select THERMAL_GOV_POWER_ALLOCATOR
  88         help
  89           Select this if you want to control temperature based on
  90           system and device power allocation. This governor can only
  91           operate on cooling devices that implement the power API.
  92
  93 endchoice
  94
  95 config THERMAL_GOV_FAIR_SHARE
  96         bool "Fair-share thermal governor"
  97         help
  98           Enable this to manage platform thermals using fair-share governor.
  99
 100 config THERMAL_GOV_STEP_WISE
 101         bool "Step_wise thermal governor"
 102         help
 103           Enable this to manage platform thermals using a simple linear
 104           governor.
 105
 106 config THERMAL_GOV_BANG_BANG
 107         bool "Bang Bang thermal governor"
 108         default n
 109         help
 110           Enable this to manage platform thermals using bang bang governor.
 111
 112           Say 'Y' here if you want to use two point temperature regulation
 113           used for fans without throttling.  Some fan drivers depend on this
 114           governor to be enabled (e.g. acerhdf).
 115
 116 config THERMAL_GOV_USER_SPACE
 117         bool "User_space thermal governor"
 118         help
 119           Enable this to let the user space manage the platform thermals.
 120
 121 config THERMAL_GOV_POWER_ALLOCATOR
 122         bool "Power allocator thermal governor"
 123         help
 124           Enable this to manage platform thermals by dynamically
 125           allocating and limiting power to devices.
 126
 127 config CPU_THERMAL
 128         bool "generic cpu cooling support"
 129         depends on CPU_FREQ
 130         depends on THERMAL_OF
 131         help
 132           This implements the generic cpu cooling mechanism through frequency
 133           reduction. An ACPI version of this already exists
 134           (drivers/acpi/processor_thermal.c).
 135           This will be useful for platforms using the generic thermal interface
 136           and not the ACPI interface.
 137
 138           If you want this support, you should say Y here.
 139
 140 config CLOCK_THERMAL
 141         bool "Generic clock cooling support"
 142         depends on COMMON_CLK
 143         depends on PM_OPP
 144         help
 145           This entry implements the generic clock cooling mechanism through
 146           frequency clipping. Typically used to cool off co-processors. The
 147           device that is configured to use this cooling mechanism will be
 148           controlled to reduce clock frequency whenever temperature is high.
 149
 150 config DEVFREQ_THERMAL
 151         bool "Generic device cooling support"
 152         depends on PM_DEVFREQ
 153         depends on PM_OPP
 154         help
 155           This implements the generic devfreq cooling mechanism through
 156           frequency reduction for devices using devfreq.
 157
 158           This will throttle the device by limiting the maximum allowed DVFS
 159           frequency corresponding to the cooling level.
 160
 161           In order to use the power extensions of the cooling device,
 162           devfreq should use the simple_ondemand governor.
 163
 164           If you want this support, you should say Y here.
 165
 166 config THERMAL_EMULATION
 167         bool "Thermal emulation mode support"
 168         help
 169           Enable this option to make a emul_temp sysfs node in thermal zone
 170           directory to support temperature emulation. With emulation sysfs node,
 171           user can manually input temperature and test the different trip
 172           threshold behaviour for simulation purpose.
 173
 174           WARNING: Be careful while enabling this option on production systems,
 175           because userland can easily disable the thermal policy by simply
 176           flooding this sysfs node with low temperature values.
 177
 178 config HISI_THERMAL
 179         tristate "Hisilicon thermal driver"
 180         depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
 181         depends on HAS_IOMEM
 182         help
 183           Enable this to plug hisilicon's thermal sensor driver into the Linux
 184           thermal framework. cpufreq is used as the cooling device to throttle
 185           CPUs when the passive trip is crossed.
 186
 187 config IMX_THERMAL
 188         tristate "Temperature sensor driver for Freescale i.MX SoCs"
 189         depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
 190         depends on MFD_SYSCON
 191         depends on OF
 192         help
 193           Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
 194           It supports one critical trip point and one passive trip point.  The
 195           cpufreq is used as the cooling device to throttle CPUs when the
 196           passive trip is crossed.
 197
 198 config MAX77620_THERMAL
 199         tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
 200         depends on MFD_MAX77620
 201         depends on OF
 202         help
 203           Support for die junction temperature warning alarm for Maxim
 204           Semiconductor PMIC MAX77620 device. Device generates two alarm
 205           interrupts when PMIC die temperature cross the threshold of
 206           120 degC and 140 degC.
 207
 208 config QORIQ_THERMAL
 209         tristate "QorIQ Thermal Monitoring Unit"
 210         depends on THERMAL_OF
 211         depends on HAS_IOMEM
 212         help
 213           Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
 214           It supports one critical trip point and one passive trip point. The
 215           cpufreq is used as the cooling device to throttle CPUs when the
 216           passive trip is crossed.
 217
 218 config SPEAR_THERMAL
 219         tristate "SPEAr thermal sensor driver"
 220         depends on PLAT_SPEAR || COMPILE_TEST
 221         depends on HAS_IOMEM
 222         depends on OF
 223         help
 224           Enable this to plug the SPEAr thermal sensor driver into the Linux
 225           thermal framework.
 226
 227 config ROCKCHIP_THERMAL
 228         tristate "Rockchip thermal driver"
 229         depends on ARCH_ROCKCHIP || COMPILE_TEST
 230         depends on RESET_CONTROLLER
 231         depends on HAS_IOMEM
 232         help
 233           Rockchip thermal driver provides support for Temperature sensor
 234           ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
 235           trip point. Cpufreq is used as the cooling device and will throttle
 236           CPUs when the Temperature crosses the passive trip point.
 237
 238 config RCAR_THERMAL
 239         tristate "Renesas R-Car thermal driver"
 240         depends on ARCH_RENESAS || COMPILE_TEST
 241         depends on HAS_IOMEM
 242         help
 243           Enable this to plug the R-Car thermal sensor driver into the Linux
 244           thermal framework.
 245
 246 config KIRKWOOD_THERMAL
 247         tristate "Temperature sensor on Marvell Kirkwood SoCs"
 248         depends on MACH_KIRKWOOD || COMPILE_TEST
 249         depends on HAS_IOMEM
 250         depends on OF
 251         help
 252           Support for the Kirkwood thermal sensor driver into the Linux thermal
 253           framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
 254
 255 config DOVE_THERMAL
 256         tristate "Temperature sensor on Marvell Dove SoCs"
 257         depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
 258         depends on HAS_IOMEM
 259         depends on OF
 260         help
 261           Support for the Dove thermal sensor driver in the Linux thermal
 262           framework.
 263
 264 config DB8500_THERMAL
 265         tristate "DB8500 thermal management"
 266         depends on MFD_DB8500_PRCMU
 267         default y
 268         help
 269           Adds DB8500 thermal management implementation according to the thermal
 270           management framework. A thermal zone with several trip points will be
 271           created. Cooling devices can be bound to the trip points to cool this
 272           thermal zone if trip points reached.
 273
 274 config ARMADA_THERMAL
 275         tristate "Armada 370/XP thermal management"
 276         depends on ARCH_MVEBU || COMPILE_TEST
 277         depends on HAS_IOMEM
 278         depends on OF
 279         help
 280           Enable this option if you want to have support for thermal management
 281           controller present in Armada 370 and Armada XP SoC.
 282
 283 config DB8500_CPUFREQ_COOLING
 284         tristate "DB8500 cpufreq cooling"
 285         depends on ARCH_U8500 || COMPILE_TEST
 286         depends on HAS_IOMEM
 287         depends on CPU_THERMAL
 288         default y
 289         help
 290           Adds DB8500 cpufreq cooling devices, and these cooling devices can be
 291           bound to thermal zone trip points. When a trip point reached, the
 292           bound cpufreq cooling device turns active to set CPU frequency low to
 293           cool down the CPU.
 294
 295 config INTEL_POWERCLAMP
 296         tristate "Intel PowerClamp idle injection driver"
 297         depends on THERMAL
 298         depends on X86
 299         depends on CPU_SUP_INTEL
 300         help
 301           Enable this to enable Intel PowerClamp idle injection driver. This
 302           enforce idle time which results in more package C-state residency. The
 303           user interface is exposed via generic thermal framework.
 304
 305 config X86_PKG_TEMP_THERMAL
 306         tristate "X86 package temperature thermal driver"
 307         depends on X86_THERMAL_VECTOR
 308         select THERMAL_GOV_USER_SPACE
 309         select THERMAL_WRITABLE_TRIPS
 310         default m
 311         help
 312           Enable this to register CPU digital sensor for package temperature as
 313           thermal zone. Each package will have its own thermal zone. There are
 314           two trip points which can be set by user to get notifications via thermal
 315           notification methods.
 316
 317 config INTEL_SOC_DTS_IOSF_CORE
 318         tristate
 319         depends on X86
 320         select IOSF_MBI
 321         help
 322           This is becoming a common feature for Intel SoCs to expose the additional
 323           digital temperature sensors (DTSs) using side band interface (IOSF). This
 324           implements the common set of helper functions to register, get temperature
 325           and get/set thresholds on DTSs.
 326
 327 config INTEL_SOC_DTS_THERMAL
 328         tristate "Intel SoCs DTS thermal driver"
 329         depends on X86
 330         select INTEL_SOC_DTS_IOSF_CORE
 331         select THERMAL_WRITABLE_TRIPS
 332         help
 333           Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
 334           temperature sensor (DTS). These SoCs have two additional DTSs in
 335           addition to DTSs on CPU cores. Each DTS will be registered as a
 336           thermal zone. There are two trip points. One of the trip point can
 337           be set by user mode programs to get notifications via Linux thermal
 338           notification methods.The other trip is a critical trip point, which
 339           was set by the driver based on the TJ MAX temperature.
 340
 341 config INTEL_QUARK_DTS_THERMAL
 342         tristate "Intel Quark DTS thermal driver"
 343         depends on X86_INTEL_QUARK
 344         help
 345           Enable this to register Intel Quark SoC (e.g. X1000) platform digital
 346           temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
 347           The DTS will be registered as a thermal zone. There are two trip points:
 348           hot & critical. The critical trip point default value is set by
 349           underlying BIOS/Firmware.
 350
 351 menu "ACPI INT340X thermal drivers"
 352 source drivers/thermal/int340x_thermal/Kconfig
 353 endmenu
 354
 355 config INTEL_BXT_PMIC_THERMAL
 356         tristate "Intel Broxton PMIC thermal driver"
 357         depends on X86 && INTEL_SOC_PMIC && REGMAP
 358         help
 359           Select this driver for Intel Broxton PMIC with ADC channels monitoring
 360           system temperature measurements and alerts.
 361           This driver is used for monitoring the ADC channels of PMIC and handles
 362           the alert trip point interrupts and notifies the thermal framework with
 363           the trip point and temperature details of the zone.
 364
 365 config INTEL_PCH_THERMAL
 366         tristate "Intel PCH Thermal Reporting Driver"
 367         depends on X86 && PCI
 368         help
 369           Enable this to support thermal reporting on certain intel PCHs.
 370           Thermal reporting device will provide temperature reading,
 371           programmable trip points and other information.
 372
 373 config MTK_THERMAL
 374         tristate "Temperature sensor driver for mediatek SoCs"
 375         depends on ARCH_MEDIATEK || COMPILE_TEST
 376         depends on HAS_IOMEM
 377         depends on NVMEM || NVMEM=n
 378         depends on RESET_CONTROLLER
 379         default y
 380         help
 381           Enable this option if you want to have support for thermal management
 382           controller present in Mediatek SoCs
 383
 384 menu "Texas Instruments thermal drivers"
 385 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
 386 depends on HAS_IOMEM
 387 source "drivers/thermal/ti-soc-thermal/Kconfig"
 388 endmenu
 389
 390 menu "Samsung thermal drivers"
 391 depends on ARCH_EXYNOS || COMPILE_TEST
 392 source "drivers/thermal/samsung/Kconfig"
 393 endmenu
 394
 395 menu "STMicroelectronics thermal drivers"
 396 depends on ARCH_STI && OF
 397 source "drivers/thermal/st/Kconfig"
 398 endmenu
 399
 400 config TANGO_THERMAL
 401         tristate "Tango thermal management"
 402         depends on ARCH_TANGO || COMPILE_TEST
 403         help
 404           Enable the Tango thermal driver, which supports the primitive
 405           temperature sensor embedded in Tango chips since the SMP8758.
 406           This sensor only generates a 1-bit signal to indicate whether
 407           the die temperature exceeds a programmable threshold.
 408
 409 source "drivers/thermal/tegra/Kconfig"
 410
 411 config QCOM_SPMI_TEMP_ALARM
 412         tristate "Qualcomm SPMI PMIC Temperature Alarm"
 413         depends on OF && SPMI && IIO
 414         select REGMAP_SPMI
 415         help
 416           This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
 417           PMIC devices. It shows up in sysfs as a thermal sensor with multiple
 418           trip points. The temperature reported by the thermal sensor reflects the
 419           real time die temperature if an ADC is present or an estimate of the
 420           temperature based upon the over temperature stage value.
 421
 422 config GENERIC_ADC_THERMAL
 423         tristate "Generic ADC based thermal sensor"
 424         depends on IIO
 425         help
 426           This enabled a thermal sysfs driver for the temperature sensor
 427           which is connected to the General Purpose ADC. The ADC channel
 428           is read via IIO framework and the channel information is provided
 429           to this driver. This driver reports the temperature by reading ADC
 430           channel and converts it to temperature based on lookup table.
 431
 432 menu "Qualcomm thermal drivers"
 433 depends on (ARCH_QCOM && OF) || COMPILE_TEST
 434 source "drivers/thermal/qcom/Kconfig"
 435 endmenu
 436
 437 endif