[deliverable/linux.git] / drivers / thermal / Kconfig

#
# Generic thermal sysfs drivers configuration
#

menuconfig THERMAL
	tristate "Generic Thermal sysfs driver"
	help
	  Generic Thermal Sysfs driver offers a generic mechanism for
	  thermal management. Usually it's made up of one or more thermal
	  zone and cooling device.
	  Each thermal zone contains its own temperature, trip points,
	  cooling devices.
	  All platforms with ACPI thermal support can use this driver.
	  If you want this support, you should say Y or M here.

if THERMAL

config THERMAL_HWMON
	bool
	prompt "Expose thermal sensors as hwmon device"
	depends on HWMON=y || HWMON=THERMAL
	default y
	help
	  In case a sensor is registered with the thermal
	  framework, this option will also register it
	  as a hwmon. The sensor will then have the common
	  hwmon sysfs interface.

	  Say 'Y' here if you want all thermal sensors to
	  have hwmon sysfs interface too.

config THERMAL_OF
	bool
	prompt "APIs to parse thermal data out of device tree"
	depends on OF
	default y
	help
	  This options provides helpers to add the support to
	  read and parse thermal data definitions out of the
	  device tree blob.

	  Say 'Y' here if you need to build thermal infrastructure
	  based on device tree.

config THERMAL_WRITABLE_TRIPS
	bool "Enable writable trip points"
	help
	  This option allows the system integrator to choose whether
	  trip temperatures can be changed from userspace. The
	  writable trips need to be specified when setting up the
	  thermal zone but the choice here takes precedence.

	  Say 'Y' here if you would like to allow userspace tools to
	  change trip temperatures.

choice
	prompt "Default Thermal governor"
	default THERMAL_DEFAULT_GOV_STEP_WISE
	help
	  This option sets which thermal governor shall be loaded at
	  startup. If in doubt, select 'step_wise'.

config THERMAL_DEFAULT_GOV_STEP_WISE
	bool "step_wise"
	select THERMAL_GOV_STEP_WISE
	help
	  Use the step_wise governor as default. This throttles the
	  devices one step at a time.

config THERMAL_DEFAULT_GOV_FAIR_SHARE
	bool "fair_share"
	select THERMAL_GOV_FAIR_SHARE
	help
	  Use the fair_share governor as default. This throttles the
	  devices based on their 'contribution' to a zone. The
	  contribution should be provided through platform data.

config THERMAL_DEFAULT_GOV_USER_SPACE
	bool "user_space"
	select THERMAL_GOV_USER_SPACE
	help
	  Select this if you want to let the user space manage the
	  platform thermals.

config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
	bool "power_allocator"
	select THERMAL_GOV_POWER_ALLOCATOR
	help
	  Select this if you want to control temperature based on
	  system and device power allocation. This governor can only
	  operate on cooling devices that implement the power API.

endchoice

config THERMAL_GOV_FAIR_SHARE
	bool "Fair-share thermal governor"
	help
	  Enable this to manage platform thermals using fair-share governor.

config THERMAL_GOV_STEP_WISE
	bool "Step_wise thermal governor"
	help
	  Enable this to manage platform thermals using a simple linear
	  governor.

config THERMAL_GOV_BANG_BANG
	bool "Bang Bang thermal governor"
	default n
	help
	  Enable this to manage platform thermals using bang bang governor.

	  Say 'Y' here if you want to use two point temperature regulation
	  used for fans without throttling.  Some fan drivers depend on this
	  governor to be enabled (e.g. acerhdf).

config THERMAL_GOV_USER_SPACE
	bool "User_space thermal governor"
	help
	  Enable this to let the user space manage the platform thermals.

config THERMAL_GOV_POWER_ALLOCATOR
	bool "Power allocator thermal governor"
	help
	  Enable this to manage platform thermals by dynamically
	  allocating and limiting power to devices.

config CPU_THERMAL
	bool "generic cpu cooling support"
	depends on CPU_FREQ
	depends on THERMAL_OF
	help
	  This implements the generic cpu cooling mechanism through frequency
	  reduction. An ACPI version of this already exists
	  (drivers/acpi/processor_thermal.c).
	  This will be useful for platforms using the generic thermal interface
	  and not the ACPI interface.

	  If you want this support, you should say Y here.

config CLOCK_THERMAL
	bool "Generic clock cooling support"
	depends on COMMON_CLK
	depends on PM_OPP
	help
	  This entry implements the generic clock cooling mechanism through
	  frequency clipping. Typically used to cool off co-processors. The
	  device that is configured to use this cooling mechanism will be
	  controlled to reduce clock frequency whenever temperature is high.

	  If you want this support, you should say Y here.

config THERMAL_EMULATION
	bool "Thermal emulation mode support"
	help
	  Enable this option to make a emul_temp sysfs node in thermal zone
	  directory to support temperature emulation. With emulation sysfs node,
	  user can manually input temperature and test the different trip
	  threshold behaviour for simulation purpose.

	  WARNING: Be careful while enabling this option on production systems,
	  because userland can easily disable the thermal policy by simply
	  flooding this sysfs node with low temperature values.

config IMX_THERMAL
	tristate "Temperature sensor driver for Freescale i.MX SoCs"
	depends on CPU_THERMAL
	depends on MFD_SYSCON
	depends on OF
	help
	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
	  It supports one critical trip point and one passive trip point.  The
	  cpufreq is used as the cooling device to throttle CPUs when the
	  passive trip is crossed.

config SPEAR_THERMAL
	bool "SPEAr thermal sensor driver"
	depends on PLAT_SPEAR
	depends on OF
	help
	  Enable this to plug the SPEAr thermal sensor driver into the Linux
	  thermal framework.

config ROCKCHIP_THERMAL
	tristate "Rockchip thermal driver"
	depends on ARCH_ROCKCHIP
	depends on RESET_CONTROLLER
	help
	  Rockchip thermal driver provides support for Temperature sensor
	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
	  trip point. Cpufreq is used as the cooling device and will throttle
	  CPUs when the Temperature crosses the passive trip point.

config RCAR_THERMAL
	tristate "Renesas R-Car thermal driver"
	depends on ARCH_SHMOBILE || COMPILE_TEST
	depends on HAS_IOMEM
	help
	  Enable this to plug the R-Car thermal sensor driver into the Linux
	  thermal framework.

config KIRKWOOD_THERMAL
	tristate "Temperature sensor on Marvell Kirkwood SoCs"
	depends on MACH_KIRKWOOD
	depends on OF
	help
	  Support for the Kirkwood thermal sensor driver into the Linux thermal
	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.

config DOVE_THERMAL
	tristate "Temperature sensor on Marvell Dove SoCs"
	depends on ARCH_DOVE || MACH_DOVE
	depends on OF
	help
	  Support for the Dove thermal sensor driver in the Linux thermal
	  framework.

config DB8500_THERMAL
	bool "DB8500 thermal management"
	depends on ARCH_U8500
	default y
	help
	  Adds DB8500 thermal management implementation according to the thermal
	  management framework. A thermal zone with several trip points will be
	  created. Cooling devices can be bound to the trip points to cool this
	  thermal zone if trip points reached.

config ARMADA_THERMAL
	tristate "Armada 370/XP thermal management"
	depends on ARCH_MVEBU
	depends on OF
	help
	  Enable this option if you want to have support for thermal management
	  controller present in Armada 370 and Armada XP SoC.

config TEGRA_SOCTHERM
	tristate "Tegra SOCTHERM thermal management"
	depends on ARCH_TEGRA
	help
	  Enable this option for integrated thermal management support on NVIDIA
	  Tegra124 systems-on-chip. The driver supports four thermal zones
	  (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
	  zones to manage temperatures. This option is also required for the
	  emergency thermal reset (thermtrip) feature to function.

config DB8500_CPUFREQ_COOLING
	tristate "DB8500 cpufreq cooling"
	depends on ARCH_U8500
	depends on CPU_THERMAL
	default y
	help
	  Adds DB8500 cpufreq cooling devices, and these cooling devices can be
	  bound to thermal zone trip points. When a trip point reached, the
	  bound cpufreq cooling device turns active to set CPU frequency low to
	  cool down the CPU.

config INTEL_POWERCLAMP
	tristate "Intel PowerClamp idle injection driver"
	depends on THERMAL
	depends on X86
	depends on CPU_SUP_INTEL
	help
	  Enable this to enable Intel PowerClamp idle injection driver. This
	  enforce idle time which results in more package C-state residency. The
	  user interface is exposed via generic thermal framework.

config X86_PKG_TEMP_THERMAL
	tristate "X86 package temperature thermal driver"
	depends on X86_THERMAL_VECTOR
	select THERMAL_GOV_USER_SPACE
	default m
	help
	  Enable this to register CPU digital sensor for package temperature as
	  thermal zone. Each package will have its own thermal zone. There are
	  two trip points which can be set by user to get notifications via thermal
	  notification methods.

config INTEL_SOC_DTS_THERMAL
	tristate "Intel SoCs DTS thermal driver"
	depends on X86 && IOSF_MBI
	help
	  Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
	  temperature sensor (DTS). These SoCs have two additional DTSs in
	  addition to DTSs on CPU cores. Each DTS will be registered as a
	  thermal zone. There are two trip points. One of the trip point can
	  be set by user mode programs to get notifications via Linux thermal
	  notification methods.The other trip is a critical trip point, which
	  was set by the driver based on the TJ MAX temperature.

config INT340X_THERMAL
	tristate "ACPI INT340X thermal drivers"
	depends on X86 && ACPI
	select THERMAL_GOV_USER_SPACE
	select ACPI_THERMAL_REL
	select ACPI_FAN
	help
	  Newer laptops and tablets that use ACPI may have thermal sensors and
	  other devices with thermal control capabilities outside the core
	  CPU/SOC, for thermal safety reasons.
	  They are exposed for the OS to use via the INT3400 ACPI device object
	  as the master, and INT3401~INT340B ACPI device objects as the slaves.
	  Enable this to expose the temperature information and cooling ability
	  from these objects to userspace via the normal thermal framework.
	  This means that a wide range of applications and GUI widgets can show
	  the information to the user or use this information for making
	  decisions. For example, the Intel Thermal Daemon can use this
	  information to allow the user to select his laptop to run without
	  turning on the fans.

config ACPI_THERMAL_REL
	tristate
	depends on ACPI

menu "Texas Instruments thermal drivers"
source "drivers/thermal/ti-soc-thermal/Kconfig"
endmenu

menu "Samsung thermal drivers"
depends on ARCH_EXYNOS
source "drivers/thermal/samsung/Kconfig"
endmenu

menu "STMicroelectronics thermal drivers"
depends on ARCH_STI && OF
source "drivers/thermal/st/Kconfig"
endmenu

config QCOM_SPMI_TEMP_ALARM
	tristate "Qualcomm SPMI PMIC Temperature Alarm"
	depends on OF && SPMI && IIO
	select REGMAP_SPMI
	help
	  This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
	  PMIC devices. It shows up in sysfs as a thermal sensor with multiple
	  trip points. The temperature reported by the thermal sensor reflects the
	  real time die temperature if an ADC is present or an estimate of the
	  temperature based upon the over temperature stage value.

endif
Commit	Line	Data
203d3d4a ZR	1	#
	2	# Generic thermal sysfs drivers configuration
	3	#
	4
	5	menuconfig THERMAL
63c4ec90	6	tristate "Generic Thermal sysfs driver"
203d3d4a ZR	7	help
	8	Generic Thermal Sysfs driver offers a generic mechanism for
	9	thermal management. Usually it's made up of one or more thermal
	10	zone and cooling device.
543a9561	11	Each thermal zone contains its own temperature, trip points,
203d3d4a ZR	12	cooling devices.
203d3d4a ZR	13	All platforms with ACPI thermal support can use this driver.
63c4ec90	14	If you want this support, you should say Y or M here.
16d75239	15
72e19897 ZR	16	if THERMAL
72e19897 ZR	17
16d75239	18	config THERMAL_HWMON
ab92402a	19	bool
0dd88793	20	prompt "Expose thermal sensors as hwmon device"
16d75239	21	depends on HWMON=y \|\| HWMON=THERMAL
ab92402a	22	default y
0dd88793 EV	23	help
	24	In case a sensor is registered with the thermal
	25	framework, this option will also register it
	26	as a hwmon. The sensor will then have the common
	27	hwmon sysfs interface.
	28
	29	Say 'Y' here if you want all thermal sensors to
	30	have hwmon sysfs interface too.
6a92c366	31
4e5e4705 EV	32	config THERMAL_OF
	33	bool
	34	prompt "APIs to parse thermal data out of device tree"
	35	depends on OF
	36	default y
	37	help
	38	This options provides helpers to add the support to
	39	read and parse thermal data definitions out of the
	40	device tree blob.
	41
	42	Say 'Y' here if you need to build thermal infrastructure
	43	based on device tree.
	44
35e94644 PA	45	config THERMAL_WRITABLE_TRIPS
	46	bool "Enable writable trip points"
	47	help
	48	This option allows the system integrator to choose whether
	49	trip temperatures can be changed from userspace. The
	50	writable trips need to be specified when setting up the
	51	thermal zone but the choice here takes precedence.
	52
	53	Say 'Y' here if you would like to allow userspace tools to
	54	change trip temperatures.
	55
72e19897 ZR	56	choice
	57	prompt "Default Thermal governor"
	58	default THERMAL_DEFAULT_GOV_STEP_WISE
	59	help
	60	This option sets which thermal governor shall be loaded at
	61	startup. If in doubt, select 'step_wise'.
	62
	63	config THERMAL_DEFAULT_GOV_STEP_WISE
	64	bool "step_wise"
9d185d04	65	select THERMAL_GOV_STEP_WISE
72e19897 ZR	66	help
	67	Use the step_wise governor as default. This throttles the
	68	devices one step at a time.
	69
	70	config THERMAL_DEFAULT_GOV_FAIR_SHARE
	71	bool "fair_share"
9d185d04	72	select THERMAL_GOV_FAIR_SHARE
72e19897 ZR	73	help
	74	Use the fair_share governor as default. This throttles the
	75	devices based on their 'contribution' to a zone. The
	76	contribution should be provided through platform data.
	77
	78	config THERMAL_DEFAULT_GOV_USER_SPACE
	79	bool "user_space"
9d185d04	80	select THERMAL_GOV_USER_SPACE
72e19897 ZR	81	help
72e19897 ZR	82	Select this if you want to let the user space manage the
ece238fe	83	platform thermals.
72e19897	84
6b775e87 JM	85	config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
	86	bool "power_allocator"
	87	select THERMAL_GOV_POWER_ALLOCATOR
	88	help
	89	Select this if you want to control temperature based on
	90	system and device power allocation. This governor can only
	91	operate on cooling devices that implement the power API.
	92
72e19897 ZR	93	endchoice
72e19897 ZR	94
9d185d04	95	config THERMAL_GOV_FAIR_SHARE
72e19897 ZR	96	bool "Fair-share thermal governor"
	97	help
	98	Enable this to manage platform thermals using fair-share governor.
	99
9d185d04	100	config THERMAL_GOV_STEP_WISE
72e19897 ZR	101	bool "Step_wise thermal governor"
	102	help
	103	Enable this to manage platform thermals using a simple linear
a8227948	104	governor.
72e19897	105
e4dbf98f PF	106	config THERMAL_GOV_BANG_BANG
	107	bool "Bang Bang thermal governor"
	108	default n
	109	help
	110	Enable this to manage platform thermals using bang bang governor.
	111
	112	Say 'Y' here if you want to use two point temperature regulation
	113	used for fans without throttling. Some fan drivers depend on this
	114	governor to be enabled (e.g. acerhdf).
	115
9d185d04	116	config THERMAL_GOV_USER_SPACE
72e19897 ZR	117	bool "User_space thermal governor"
	118	help
	119	Enable this to let the user space manage the platform thermals.
	120
6b775e87 JM	121	config THERMAL_GOV_POWER_ALLOCATOR
6b775e87 JM	122	bool "Power allocator thermal governor"
6b775e87 JM	123	help
	124	Enable this to manage platform thermals by dynamically
	125	allocating and limiting power to devices.
	126
02361418	127	config CPU_THERMAL
bbf7fc88	128	bool "generic cpu cooling support"
72e19897	129	depends on CPU_FREQ
39d99cff	130	depends on THERMAL_OF
02361418 ADK	131	help
02361418 ADK	132	This implements the generic cpu cooling mechanism through frequency
f7188b3d EV	133	reduction. An ACPI version of this already exists
f7188b3d EV	134	(drivers/acpi/processor_thermal.c).
02361418 ADK	135	This will be useful for platforms using the generic thermal interface
02361418 ADK	136	and not the ACPI interface.
f7188b3d	137
02361418 ADK	138	If you want this support, you should say Y here.
02361418 ADK	139
f9df89d8 EV	140	config CLOCK_THERMAL
	141	bool "Generic clock cooling support"
	142	depends on COMMON_CLK
	143	depends on PM_OPP
	144	help
	145	This entry implements the generic clock cooling mechanism through
	146	frequency clipping. Typically used to cool off co-processors. The
	147	device that is configured to use this cooling mechanism will be
	148	controlled to reduce clock frequency whenever temperature is high.
	149
	150	If you want this support, you should say Y here.
	151
e6e238c3 ADK	152	config THERMAL_EMULATION
	153	bool "Thermal emulation mode support"
	154	help
	155	Enable this option to make a emul_temp sysfs node in thermal zone
	156	directory to support temperature emulation. With emulation sysfs node,
	157	user can manually input temperature and test the different trip
	158	threshold behaviour for simulation purpose.
	159
8837295a EV	160	WARNING: Be careful while enabling this option on production systems,
	161	because userland can easily disable the thermal policy by simply
	162	flooding this sysfs node with low temperature values.
	163
ca3de46b SG	164	config IMX_THERMAL
	165	tristate "Temperature sensor driver for Freescale i.MX SoCs"
	166	depends on CPU_THERMAL
	167	depends on MFD_SYSCON
	168	depends on OF
	169	help
	170	Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
	171	It supports one critical trip point and one passive trip point. The
	172	cpufreq is used as the cooling device to throttle CPUs when the
	173	passive trip is crossed.
	174
6a92c366 VF	175	config SPEAR_THERMAL
6a92c366 VF	176	bool "SPEAr thermal sensor driver"
6a92c366	177	depends on PLAT_SPEAR
b9c7aff4	178	depends on OF
6a92c366 VF	179	help
6a92c366 VF	180	Enable this to plug the SPEAr thermal sensor driver into the Linux
a8227948	181	thermal framework.
1e426ffd	182
cbac8f63 CW	183	config ROCKCHIP_THERMAL
	184	tristate "Rockchip thermal driver"
	185	depends on ARCH_ROCKCHIP
	186	depends on RESET_CONTROLLER
	187	help
	188	Rockchip thermal driver provides support for Temperature sensor
	189	ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
	190	trip point. Cpufreq is used as the cooling device and will throttle
	191	CPUs when the Temperature crosses the passive trip point.
	192
1e426ffd KM	193	config RCAR_THERMAL
1e426ffd KM	194	tristate "Renesas R-Car thermal driver"
beeb5a1e	195	depends on ARCH_SHMOBILE \|\| COMPILE_TEST
d1c8b041	196	depends on HAS_IOMEM
1e426ffd KM	197	help
1e426ffd KM	198	Enable this to plug the R-Car thermal sensor driver into the Linux
a8227948	199	thermal framework.
c48cbba6	200
7060aa36 NI	201	config KIRKWOOD_THERMAL
7060aa36 NI	202	tristate "Temperature sensor on Marvell Kirkwood SoCs"
575be653	203	depends on MACH_KIRKWOOD
7060aa36 NI	204	depends on OF
	205	help
	206	Support for the Kirkwood thermal sensor driver into the Linux thermal
	207	framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
	208
74ffa64c AL	209	config DOVE_THERMAL
74ffa64c AL	210	tristate "Temperature sensor on Marvell Dove SoCs"
b3dee390	211	depends on ARCH_DOVE \|\| MACH_DOVE
74ffa64c AL	212	depends on OF
	213	help
	214	Support for the Dove thermal sensor driver in the Linux thermal
	215	framework.
	216
aa1acb04	217	config DB8500_THERMAL
	218	bool "DB8500 thermal management"
	219	depends on ARCH_U8500
	220	default y
	221	help
	222	Adds DB8500 thermal management implementation according to the thermal
	223	management framework. A thermal zone with several trip points will be
	224	created. Cooling devices can be bound to the trip points to cool this
	225	thermal zone if trip points reached.
	226
fa0d654c EG	227	config ARMADA_THERMAL
	228	tristate "Armada 370/XP thermal management"
	229	depends on ARCH_MVEBU
	230	depends on OF
	231	help
	232	Enable this option if you want to have support for thermal management
	233	controller present in Armada 370 and Armada XP SoC.
	234
66fb8480 MP	235	config TEGRA_SOCTHERM
	236	tristate "Tegra SOCTHERM thermal management"
	237	depends on ARCH_TEGRA
	238	help
	239	Enable this option for integrated thermal management support on NVIDIA
	240	Tegra124 systems-on-chip. The driver supports four thermal zones
	241	(CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
	242	zones to manage temperatures. This option is also required for the
	243	emergency thermal reset (thermtrip) feature to function.
	244
aa1acb04	245	config DB8500_CPUFREQ_COOLING
	246	tristate "DB8500 cpufreq cooling"
	247	depends on ARCH_U8500
	248	depends on CPU_THERMAL
	249	default y
	250	help
	251	Adds DB8500 cpufreq cooling devices, and these cooling devices can be
	252	bound to thermal zone trip points. When a trip point reached, the
	253	bound cpufreq cooling device turns active to set CPU frequency low to
	254	cool down the CPU.
a56757af	255
d6d71ee4 JP	256	config INTEL_POWERCLAMP
	257	tristate "Intel PowerClamp idle injection driver"
	258	depends on THERMAL
	259	depends on X86
	260	depends on CPU_SUP_INTEL
	261	help
	262	Enable this to enable Intel PowerClamp idle injection driver. This
	263	enforce idle time which results in more package C-state residency. The
	264	user interface is exposed via generic thermal framework.
	265
f1a18a10 SP	266	config X86_PKG_TEMP_THERMAL
f1a18a10 SP	267	tristate "X86 package temperature thermal driver"
b3ba0206	268	depends on X86_THERMAL_VECTOR
f1a18a10 SP	269	select THERMAL_GOV_USER_SPACE
	270	default m
	271	help
	272	Enable this to register CPU digital sensor for package temperature as
	273	thermal zone. Each package will have its own thermal zone. There are
	274	two trip points which can be set by user to get notifications via thermal
	275	notification methods.
	276
bc40b5e3 SP	277	config INTEL_SOC_DTS_THERMAL
	278	tristate "Intel SoCs DTS thermal driver"
	279	depends on X86 && IOSF_MBI
	280	help
	281	Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
	282	temperature sensor (DTS). These SoCs have two additional DTSs in
	283	addition to DTSs on CPU cores. Each DTS will be registered as a
	284	thermal zone. There are two trip points. One of the trip point can
	285	be set by user mode programs to get notifications via Linux thermal
	286	notification methods.The other trip is a critical trip point, which
	287	was set by the driver based on the TJ MAX temperature.
	288
3230bbfc	289	config INT340X_THERMAL
816cab93	290	tristate "ACPI INT340X thermal drivers"
3230bbfc	291	depends on X86 && ACPI
0ab15365	292	select THERMAL_GOV_USER_SPACE
52b1c69d	293	select ACPI_THERMAL_REL
d8054749	294	select ACPI_FAN
3230bbfc ZR	295	help
	296	Newer laptops and tablets that use ACPI may have thermal sensors and
	297	other devices with thermal control capabilities outside the core
	298	CPU/SOC, for thermal safety reasons.
	299	They are exposed for the OS to use via the INT3400 ACPI device object
	300	as the master, and INT3401~INT340B ACPI device objects as the slaves.
	301	Enable this to expose the temperature information and cooling ability
	302	from these objects to userspace via the normal thermal framework.
	303	This means that a wide range of applications and GUI widgets can show
	304	the information to the user or use this information for making
	305	decisions. For example, the Intel Thermal Daemon can use this
	306	information to allow the user to select his laptop to run without
	307	turning on the fans.
	308
52b1c69d JP	309	config ACPI_THERMAL_REL
	310	tristate
	311	depends on ACPI
	312
eb982001 EV	313	menu "Texas Instruments thermal drivers"
	314	source "drivers/thermal/ti-soc-thermal/Kconfig"
	315	endmenu
f157f596	316
c6821378	317	menu "Samsung thermal drivers"
4de45817	318	depends on ARCH_EXYNOS
c6821378 ADK	319	source "drivers/thermal/samsung/Kconfig"
	320	endmenu
	321
60aef7ce LJ	322	menu "STMicroelectronics thermal drivers"
	323	depends on ARCH_STI && OF
	324	source "drivers/thermal/st/Kconfig"
	325	endmenu
	326
c610afaa II	327	config QCOM_SPMI_TEMP_ALARM
	328	tristate "Qualcomm SPMI PMIC Temperature Alarm"
	329	depends on OF && SPMI && IIO
	330	select REGMAP_SPMI
	331	help
	332	This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
	333	PMIC devices. It shows up in sysfs as a thermal sensor with multiple
	334	trip points. The temperature reported by the thermal sensor reflects the
	335	real time die temperature if an ADC is present or an estimate of the
	336	temperature based upon the over temperature stage value.
	337
72e19897	338	endif