edac: remove proc_name from mci structure
[deliverable/linux.git] / include / linux / edac.h
1 /*
2 * Generic EDAC defs
3 *
4 * Author: Dave Jiang <djiang@mvista.com>
5 *
6 * 2006-2008 (c) MontaVista Software, Inc. This file is licensed under
7 * the terms of the GNU General Public License version 2. This program
8 * is licensed "as is" without any warranty of any kind, whether express
9 * or implied.
10 *
11 */
12 #ifndef _LINUX_EDAC_H_
13 #define _LINUX_EDAC_H_
14
15 #include <linux/atomic.h>
16 #include <linux/device.h>
17 #include <linux/completion.h>
18 #include <linux/workqueue.h>
19 #include <linux/debugfs.h>
20
21 struct device;
22
23 #define EDAC_OPSTATE_INVAL -1
24 #define EDAC_OPSTATE_POLL 0
25 #define EDAC_OPSTATE_NMI 1
26 #define EDAC_OPSTATE_INT 2
27
28 extern int edac_op_state;
29 extern int edac_err_assert;
30 extern atomic_t edac_handlers;
31 extern struct bus_type edac_subsys;
32
33 extern int edac_handler_set(void);
34 extern void edac_atomic_assert_error(void);
35 extern struct bus_type *edac_get_sysfs_subsys(void);
36 extern void edac_put_sysfs_subsys(void);
37
38 static inline void opstate_init(void)
39 {
40 switch (edac_op_state) {
41 case EDAC_OPSTATE_POLL:
42 case EDAC_OPSTATE_NMI:
43 break;
44 default:
45 edac_op_state = EDAC_OPSTATE_POLL;
46 }
47 return;
48 }
49
50 #define EDAC_MC_LABEL_LEN 31
51
52 /**
53 * enum dev_type - describe the type of memory DRAM chips used at the stick
54 * @DEV_UNKNOWN: Can't be determined, or MC doesn't support detect it
55 * @DEV_X1: 1 bit for data
56 * @DEV_X2: 2 bits for data
57 * @DEV_X4: 4 bits for data
58 * @DEV_X8: 8 bits for data
59 * @DEV_X16: 16 bits for data
60 * @DEV_X32: 32 bits for data
61 * @DEV_X64: 64 bits for data
62 *
63 * Typical values are x4 and x8.
64 */
65 enum dev_type {
66 DEV_UNKNOWN = 0,
67 DEV_X1,
68 DEV_X2,
69 DEV_X4,
70 DEV_X8,
71 DEV_X16,
72 DEV_X32, /* Do these parts exist? */
73 DEV_X64 /* Do these parts exist? */
74 };
75
76 #define DEV_FLAG_UNKNOWN BIT(DEV_UNKNOWN)
77 #define DEV_FLAG_X1 BIT(DEV_X1)
78 #define DEV_FLAG_X2 BIT(DEV_X2)
79 #define DEV_FLAG_X4 BIT(DEV_X4)
80 #define DEV_FLAG_X8 BIT(DEV_X8)
81 #define DEV_FLAG_X16 BIT(DEV_X16)
82 #define DEV_FLAG_X32 BIT(DEV_X32)
83 #define DEV_FLAG_X64 BIT(DEV_X64)
84
85 /**
86 * enum hw_event_mc_err_type - type of the detected error
87 *
88 * @HW_EVENT_ERR_CORRECTED: Corrected Error - Indicates that an ECC
89 * corrected error was detected
90 * @HW_EVENT_ERR_UNCORRECTED: Uncorrected Error - Indicates an error that
91 * can't be corrected by ECC, but it is not
92 * fatal (maybe it is on an unused memory area,
93 * or the memory controller could recover from
94 * it for example, by re-trying the operation).
95 * @HW_EVENT_ERR_FATAL: Fatal Error - Uncorrected error that could not
96 * be recovered.
97 */
98 enum hw_event_mc_err_type {
99 HW_EVENT_ERR_CORRECTED,
100 HW_EVENT_ERR_UNCORRECTED,
101 HW_EVENT_ERR_FATAL,
102 };
103
104 /**
105 * enum mem_type - memory types. For a more detailed reference, please see
106 * http://en.wikipedia.org/wiki/DRAM
107 *
108 * @MEM_EMPTY Empty csrow
109 * @MEM_RESERVED: Reserved csrow type
110 * @MEM_UNKNOWN: Unknown csrow type
111 * @MEM_FPM: FPM - Fast Page Mode, used on systems up to 1995.
112 * @MEM_EDO: EDO - Extended data out, used on systems up to 1998.
113 * @MEM_BEDO: BEDO - Burst Extended data out, an EDO variant.
114 * @MEM_SDR: SDR - Single data rate SDRAM
115 * http://en.wikipedia.org/wiki/Synchronous_dynamic_random-access_memory
116 * They use 3 pins for chip select: Pins 0 and 2 are
117 * for rank 0; pins 1 and 3 are for rank 1, if the memory
118 * is dual-rank.
119 * @MEM_RDR: Registered SDR SDRAM
120 * @MEM_DDR: Double data rate SDRAM
121 * http://en.wikipedia.org/wiki/DDR_SDRAM
122 * @MEM_RDDR: Registered Double data rate SDRAM
123 * This is a variant of the DDR memories.
124 * A registered memory has a buffer inside it, hiding
125 * part of the memory details to the memory controller.
126 * @MEM_RMBS: Rambus DRAM, used on a few Pentium III/IV controllers.
127 * @MEM_DDR2: DDR2 RAM, as described at JEDEC JESD79-2F.
128 * Those memories are labed as "PC2-" instead of "PC" to
129 * differenciate from DDR.
130 * @MEM_FB_DDR2: Fully-Buffered DDR2, as described at JEDEC Std No. 205
131 * and JESD206.
132 * Those memories are accessed per DIMM slot, and not by
133 * a chip select signal.
134 * @MEM_RDDR2: Registered DDR2 RAM
135 * This is a variant of the DDR2 memories.
136 * @MEM_XDR: Rambus XDR
137 * It is an evolution of the original RAMBUS memories,
138 * created to compete with DDR2. Weren't used on any
139 * x86 arch, but cell_edac PPC memory controller uses it.
140 * @MEM_DDR3: DDR3 RAM
141 * @MEM_RDDR3: Registered DDR3 RAM
142 * This is a variant of the DDR3 memories.
143 */
144 enum mem_type {
145 MEM_EMPTY = 0,
146 MEM_RESERVED,
147 MEM_UNKNOWN,
148 MEM_FPM,
149 MEM_EDO,
150 MEM_BEDO,
151 MEM_SDR,
152 MEM_RDR,
153 MEM_DDR,
154 MEM_RDDR,
155 MEM_RMBS,
156 MEM_DDR2,
157 MEM_FB_DDR2,
158 MEM_RDDR2,
159 MEM_XDR,
160 MEM_DDR3,
161 MEM_RDDR3,
162 };
163
164 #define MEM_FLAG_EMPTY BIT(MEM_EMPTY)
165 #define MEM_FLAG_RESERVED BIT(MEM_RESERVED)
166 #define MEM_FLAG_UNKNOWN BIT(MEM_UNKNOWN)
167 #define MEM_FLAG_FPM BIT(MEM_FPM)
168 #define MEM_FLAG_EDO BIT(MEM_EDO)
169 #define MEM_FLAG_BEDO BIT(MEM_BEDO)
170 #define MEM_FLAG_SDR BIT(MEM_SDR)
171 #define MEM_FLAG_RDR BIT(MEM_RDR)
172 #define MEM_FLAG_DDR BIT(MEM_DDR)
173 #define MEM_FLAG_RDDR BIT(MEM_RDDR)
174 #define MEM_FLAG_RMBS BIT(MEM_RMBS)
175 #define MEM_FLAG_DDR2 BIT(MEM_DDR2)
176 #define MEM_FLAG_FB_DDR2 BIT(MEM_FB_DDR2)
177 #define MEM_FLAG_RDDR2 BIT(MEM_RDDR2)
178 #define MEM_FLAG_XDR BIT(MEM_XDR)
179 #define MEM_FLAG_DDR3 BIT(MEM_DDR3)
180 #define MEM_FLAG_RDDR3 BIT(MEM_RDDR3)
181
182 /**
183 * enum edac-type - Error Detection and Correction capabilities and mode
184 * @EDAC_UNKNOWN: Unknown if ECC is available
185 * @EDAC_NONE: Doesn't support ECC
186 * @EDAC_RESERVED: Reserved ECC type
187 * @EDAC_PARITY: Detects parity errors
188 * @EDAC_EC: Error Checking - no correction
189 * @EDAC_SECDED: Single bit error correction, Double detection
190 * @EDAC_S2ECD2ED: Chipkill x2 devices - do these exist?
191 * @EDAC_S4ECD4ED: Chipkill x4 devices
192 * @EDAC_S8ECD8ED: Chipkill x8 devices
193 * @EDAC_S16ECD16ED: Chipkill x16 devices
194 */
195 enum edac_type {
196 EDAC_UNKNOWN = 0,
197 EDAC_NONE,
198 EDAC_RESERVED,
199 EDAC_PARITY,
200 EDAC_EC,
201 EDAC_SECDED,
202 EDAC_S2ECD2ED,
203 EDAC_S4ECD4ED,
204 EDAC_S8ECD8ED,
205 EDAC_S16ECD16ED,
206 };
207
208 #define EDAC_FLAG_UNKNOWN BIT(EDAC_UNKNOWN)
209 #define EDAC_FLAG_NONE BIT(EDAC_NONE)
210 #define EDAC_FLAG_PARITY BIT(EDAC_PARITY)
211 #define EDAC_FLAG_EC BIT(EDAC_EC)
212 #define EDAC_FLAG_SECDED BIT(EDAC_SECDED)
213 #define EDAC_FLAG_S2ECD2ED BIT(EDAC_S2ECD2ED)
214 #define EDAC_FLAG_S4ECD4ED BIT(EDAC_S4ECD4ED)
215 #define EDAC_FLAG_S8ECD8ED BIT(EDAC_S8ECD8ED)
216 #define EDAC_FLAG_S16ECD16ED BIT(EDAC_S16ECD16ED)
217
218 /**
219 * enum scrub_type - scrubbing capabilities
220 * @SCRUB_UNKNOWN Unknown if scrubber is available
221 * @SCRUB_NONE: No scrubber
222 * @SCRUB_SW_PROG: SW progressive (sequential) scrubbing
223 * @SCRUB_SW_SRC: Software scrub only errors
224 * @SCRUB_SW_PROG_SRC: Progressive software scrub from an error
225 * @SCRUB_SW_TUNABLE: Software scrub frequency is tunable
226 * @SCRUB_HW_PROG: HW progressive (sequential) scrubbing
227 * @SCRUB_HW_SRC: Hardware scrub only errors
228 * @SCRUB_HW_PROG_SRC: Progressive hardware scrub from an error
229 * SCRUB_HW_TUNABLE: Hardware scrub frequency is tunable
230 */
231 enum scrub_type {
232 SCRUB_UNKNOWN = 0,
233 SCRUB_NONE,
234 SCRUB_SW_PROG,
235 SCRUB_SW_SRC,
236 SCRUB_SW_PROG_SRC,
237 SCRUB_SW_TUNABLE,
238 SCRUB_HW_PROG,
239 SCRUB_HW_SRC,
240 SCRUB_HW_PROG_SRC,
241 SCRUB_HW_TUNABLE
242 };
243
244 #define SCRUB_FLAG_SW_PROG BIT(SCRUB_SW_PROG)
245 #define SCRUB_FLAG_SW_SRC BIT(SCRUB_SW_SRC)
246 #define SCRUB_FLAG_SW_PROG_SRC BIT(SCRUB_SW_PROG_SRC)
247 #define SCRUB_FLAG_SW_TUN BIT(SCRUB_SW_SCRUB_TUNABLE)
248 #define SCRUB_FLAG_HW_PROG BIT(SCRUB_HW_PROG)
249 #define SCRUB_FLAG_HW_SRC BIT(SCRUB_HW_SRC)
250 #define SCRUB_FLAG_HW_PROG_SRC BIT(SCRUB_HW_PROG_SRC)
251 #define SCRUB_FLAG_HW_TUN BIT(SCRUB_HW_TUNABLE)
252
253 /* FIXME - should have notify capabilities: NMI, LOG, PROC, etc */
254
255 /* EDAC internal operation states */
256 #define OP_ALLOC 0x100
257 #define OP_RUNNING_POLL 0x201
258 #define OP_RUNNING_INTERRUPT 0x202
259 #define OP_RUNNING_POLL_INTR 0x203
260 #define OP_OFFLINE 0x300
261
262 /*
263 * Concepts used at the EDAC subsystem
264 *
265 * There are several things to be aware of that aren't at all obvious:
266 *
267 * SOCKETS, SOCKET SETS, BANKS, ROWS, CHIP-SELECT ROWS, CHANNELS, etc..
268 *
269 * These are some of the many terms that are thrown about that don't always
270 * mean what people think they mean (Inconceivable!). In the interest of
271 * creating a common ground for discussion, terms and their definitions
272 * will be established.
273 *
274 * Memory devices: The individual DRAM chips on a memory stick. These
275 * devices commonly output 4 and 8 bits each (x4, x8).
276 * Grouping several of these in parallel provides the
277 * number of bits that the memory controller expects:
278 * typically 72 bits, in order to provide 64 bits +
279 * 8 bits of ECC data.
280 *
281 * Memory Stick: A printed circuit board that aggregates multiple
282 * memory devices in parallel. In general, this is the
283 * Field Replaceable Unit (FRU) which gets replaced, in
284 * the case of excessive errors. Most often it is also
285 * called DIMM (Dual Inline Memory Module).
286 *
287 * Memory Socket: A physical connector on the motherboard that accepts
288 * a single memory stick. Also called as "slot" on several
289 * datasheets.
290 *
291 * Channel: A memory controller channel, responsible to communicate
292 * with a group of DIMMs. Each channel has its own
293 * independent control (command) and data bus, and can
294 * be used independently or grouped with other channels.
295 *
296 * Branch: It is typically the highest hierarchy on a
297 * Fully-Buffered DIMM memory controller.
298 * Typically, it contains two channels.
299 * Two channels at the same branch can be used in single
300 * mode or in lockstep mode.
301 * When lockstep is enabled, the cacheline is doubled,
302 * but it generally brings some performance penalty.
303 * Also, it is generally not possible to point to just one
304 * memory stick when an error occurs, as the error
305 * correction code is calculated using two DIMMs instead
306 * of one. Due to that, it is capable of correcting more
307 * errors than on single mode.
308 *
309 * Single-channel: The data accessed by the memory controller is contained
310 * into one dimm only. E. g. if the data is 64 bits-wide,
311 * the data flows to the CPU using one 64 bits parallel
312 * access.
313 * Typically used with SDR, DDR, DDR2 and DDR3 memories.
314 * FB-DIMM and RAMBUS use a different concept for channel,
315 * so this concept doesn't apply there.
316 *
317 * Double-channel: The data size accessed by the memory controller is
318 * interlaced into two dimms, accessed at the same time.
319 * E. g. if the DIMM is 64 bits-wide (72 bits with ECC),
320 * the data flows to the CPU using a 128 bits parallel
321 * access.
322 *
323 * Chip-select row: This is the name of the DRAM signal used to select the
324 * DRAM ranks to be accessed. Common chip-select rows for
325 * single channel are 64 bits, for dual channel 128 bits.
326 * It may not be visible by the memory controller, as some
327 * DIMM types have a memory buffer that can hide direct
328 * access to it from the Memory Controller.
329 *
330 * Single-Ranked stick: A Single-ranked stick has 1 chip-select row of memory.
331 * Motherboards commonly drive two chip-select pins to
332 * a memory stick. A single-ranked stick, will occupy
333 * only one of those rows. The other will be unused.
334 *
335 * Double-Ranked stick: A double-ranked stick has two chip-select rows which
336 * access different sets of memory devices. The two
337 * rows cannot be accessed concurrently.
338 *
339 * Double-sided stick: DEPRECATED TERM, see Double-Ranked stick.
340 * A double-sided stick has two chip-select rows which
341 * access different sets of memory devices. The two
342 * rows cannot be accessed concurrently. "Double-sided"
343 * is irrespective of the memory devices being mounted
344 * on both sides of the memory stick.
345 *
346 * Socket set: All of the memory sticks that are required for
347 * a single memory access or all of the memory sticks
348 * spanned by a chip-select row. A single socket set
349 * has two chip-select rows and if double-sided sticks
350 * are used these will occupy those chip-select rows.
351 *
352 * Bank: This term is avoided because it is unclear when
353 * needing to distinguish between chip-select rows and
354 * socket sets.
355 *
356 * Controller pages:
357 *
358 * Physical pages:
359 *
360 * Virtual pages:
361 *
362 *
363 * STRUCTURE ORGANIZATION AND CHOICES
364 *
365 *
366 *
367 * PS - I enjoyed writing all that about as much as you enjoyed reading it.
368 */
369
370 /**
371 * enum edac_mc_layer - memory controller hierarchy layer
372 *
373 * @EDAC_MC_LAYER_BRANCH: memory layer is named "branch"
374 * @EDAC_MC_LAYER_CHANNEL: memory layer is named "channel"
375 * @EDAC_MC_LAYER_SLOT: memory layer is named "slot"
376 * @EDAC_MC_LAYER_CHIP_SELECT: memory layer is named "chip select"
377 * @EDAC_MC_LAYER_ALL_MEM: memory layout is unknown. All memory is mapped
378 * as a single memory area. This is used when
379 * retrieving errors from a firmware driven driver.
380 *
381 * This enum is used by the drivers to tell edac_mc_sysfs what name should
382 * be used when describing a memory stick location.
383 */
384 enum edac_mc_layer_type {
385 EDAC_MC_LAYER_BRANCH,
386 EDAC_MC_LAYER_CHANNEL,
387 EDAC_MC_LAYER_SLOT,
388 EDAC_MC_LAYER_CHIP_SELECT,
389 EDAC_MC_LAYER_ALL_MEM,
390 };
391
392 /**
393 * struct edac_mc_layer - describes the memory controller hierarchy
394 * @layer: layer type
395 * @size: number of components per layer. For example,
396 * if the channel layer has two channels, size = 2
397 * @is_virt_csrow: This layer is part of the "csrow" when old API
398 * compatibility mode is enabled. Otherwise, it is
399 * a channel
400 */
401 struct edac_mc_layer {
402 enum edac_mc_layer_type type;
403 unsigned size;
404 bool is_virt_csrow;
405 };
406
407 /*
408 * Maximum number of layers used by the memory controller to uniquely
409 * identify a single memory stick.
410 * NOTE: Changing this constant requires not only to change the constant
411 * below, but also to change the existing code at the core, as there are
412 * some code there that are optimized for 3 layers.
413 */
414 #define EDAC_MAX_LAYERS 3
415
416 /**
417 * EDAC_DIMM_OFF - Macro responsible to get a pointer offset inside a pointer array
418 * for the element given by [layer0,layer1,layer2] position
419 *
420 * @layers: a struct edac_mc_layer array, describing how many elements
421 * were allocated for each layer
422 * @n_layers: Number of layers at the @layers array
423 * @layer0: layer0 position
424 * @layer1: layer1 position. Unused if n_layers < 2
425 * @layer2: layer2 position. Unused if n_layers < 3
426 *
427 * For 1 layer, this macro returns &var[layer0] - &var
428 * For 2 layers, this macro is similar to allocate a bi-dimensional array
429 * and to return "&var[layer0][layer1] - &var"
430 * For 3 layers, this macro is similar to allocate a tri-dimensional array
431 * and to return "&var[layer0][layer1][layer2] - &var"
432 *
433 * A loop could be used here to make it more generic, but, as we only have
434 * 3 layers, this is a little faster.
435 * By design, layers can never be 0 or more than 3. If that ever happens,
436 * a NULL is returned, causing an OOPS during the memory allocation routine,
437 * with would point to the developer that he's doing something wrong.
438 */
439 #define EDAC_DIMM_OFF(layers, nlayers, layer0, layer1, layer2) ({ \
440 int __i; \
441 if ((nlayers) == 1) \
442 __i = layer0; \
443 else if ((nlayers) == 2) \
444 __i = (layer1) + ((layers[1]).size * (layer0)); \
445 else if ((nlayers) == 3) \
446 __i = (layer2) + ((layers[2]).size * ((layer1) + \
447 ((layers[1]).size * (layer0)))); \
448 else \
449 __i = -EINVAL; \
450 __i; \
451 })
452
453 /**
454 * EDAC_DIMM_PTR - Macro responsible to get a pointer inside a pointer array
455 * for the element given by [layer0,layer1,layer2] position
456 *
457 * @layers: a struct edac_mc_layer array, describing how many elements
458 * were allocated for each layer
459 * @var: name of the var where we want to get the pointer
460 * (like mci->dimms)
461 * @n_layers: Number of layers at the @layers array
462 * @layer0: layer0 position
463 * @layer1: layer1 position. Unused if n_layers < 2
464 * @layer2: layer2 position. Unused if n_layers < 3
465 *
466 * For 1 layer, this macro returns &var[layer0]
467 * For 2 layers, this macro is similar to allocate a bi-dimensional array
468 * and to return "&var[layer0][layer1]"
469 * For 3 layers, this macro is similar to allocate a tri-dimensional array
470 * and to return "&var[layer0][layer1][layer2]"
471 */
472 #define EDAC_DIMM_PTR(layers, var, nlayers, layer0, layer1, layer2) ({ \
473 typeof(*var) __p; \
474 int ___i = EDAC_DIMM_OFF(layers, nlayers, layer0, layer1, layer2); \
475 if (___i < 0) \
476 __p = NULL; \
477 else \
478 __p = (var)[___i]; \
479 __p; \
480 })
481
482 struct dimm_info {
483 struct device dev;
484
485 char label[EDAC_MC_LABEL_LEN + 1]; /* DIMM label on motherboard */
486
487 /* Memory location data */
488 unsigned location[EDAC_MAX_LAYERS];
489
490 struct mem_ctl_info *mci; /* the parent */
491
492 u32 grain; /* granularity of reported error in bytes */
493 enum dev_type dtype; /* memory device type */
494 enum mem_type mtype; /* memory dimm type */
495 enum edac_type edac_mode; /* EDAC mode for this dimm */
496
497 u32 nr_pages; /* number of pages on this dimm */
498
499 unsigned csrow, cschannel; /* Points to the old API data */
500 };
501
502 /**
503 * struct rank_info - contains the information for one DIMM rank
504 *
505 * @chan_idx: channel number where the rank is (typically, 0 or 1)
506 * @ce_count: number of correctable errors for this rank
507 * @csrow: A pointer to the chip select row structure (the parent
508 * structure). The location of the rank is given by
509 * the (csrow->csrow_idx, chan_idx) vector.
510 * @dimm: A pointer to the DIMM structure, where the DIMM label
511 * information is stored.
512 *
513 * FIXME: Currently, the EDAC core model will assume one DIMM per rank.
514 * This is a bad assumption, but it makes this patch easier. Later
515 * patches in this series will fix this issue.
516 */
517 struct rank_info {
518 int chan_idx;
519 struct csrow_info *csrow;
520 struct dimm_info *dimm;
521
522 u32 ce_count; /* Correctable Errors for this csrow */
523 };
524
525 struct csrow_info {
526 struct device dev;
527
528 /* Used only by edac_mc_find_csrow_by_page() */
529 unsigned long first_page; /* first page number in csrow */
530 unsigned long last_page; /* last page number in csrow */
531 unsigned long page_mask; /* used for interleaving -
532 * 0UL for non intlv */
533
534 int csrow_idx; /* the chip-select row */
535
536 u32 ue_count; /* Uncorrectable Errors for this csrow */
537 u32 ce_count; /* Correctable Errors for this csrow */
538 u32 nr_pages; /* combined pages count of all channels */
539
540 struct mem_ctl_info *mci; /* the parent */
541
542 /* channel information for this csrow */
543 u32 nr_channels;
544 struct rank_info **channels;
545 };
546
547 /*
548 * struct errcount_attribute - used to store the several error counts
549 */
550 struct errcount_attribute_data {
551 int n_layers;
552 int pos[EDAC_MAX_LAYERS];
553 int layer0, layer1, layer2;
554 };
555
556 /* MEMORY controller information structure
557 */
558 struct mem_ctl_info {
559 struct device dev;
560 struct bus_type bus;
561
562 struct list_head link; /* for global list of mem_ctl_info structs */
563
564 struct module *owner; /* Module owner of this control struct */
565
566 unsigned long mtype_cap; /* memory types supported by mc */
567 unsigned long edac_ctl_cap; /* Mem controller EDAC capabilities */
568 unsigned long edac_cap; /* configuration capabilities - this is
569 * closely related to edac_ctl_cap. The
570 * difference is that the controller may be
571 * capable of s4ecd4ed which would be listed
572 * in edac_ctl_cap, but if channels aren't
573 * capable of s4ecd4ed then the edac_cap would
574 * not have that capability.
575 */
576 unsigned long scrub_cap; /* chipset scrub capabilities */
577 enum scrub_type scrub_mode; /* current scrub mode */
578
579 /* Translates sdram memory scrub rate given in bytes/sec to the
580 internal representation and configures whatever else needs
581 to be configured.
582 */
583 int (*set_sdram_scrub_rate) (struct mem_ctl_info * mci, u32 bw);
584
585 /* Get the current sdram memory scrub rate from the internal
586 representation and converts it to the closest matching
587 bandwidth in bytes/sec.
588 */
589 int (*get_sdram_scrub_rate) (struct mem_ctl_info * mci);
590
591
592 /* pointer to edac checking routine */
593 void (*edac_check) (struct mem_ctl_info * mci);
594
595 /*
596 * Remaps memory pages: controller pages to physical pages.
597 * For most MC's, this will be NULL.
598 */
599 /* FIXME - why not send the phys page to begin with? */
600 unsigned long (*ctl_page_to_phys) (struct mem_ctl_info * mci,
601 unsigned long page);
602 int mc_idx;
603 struct csrow_info **csrows;
604 unsigned nr_csrows, num_cschannel;
605
606 /*
607 * Memory Controller hierarchy
608 *
609 * There are basically two types of memory controller: the ones that
610 * sees memory sticks ("dimms"), and the ones that sees memory ranks.
611 * All old memory controllers enumerate memories per rank, but most
612 * of the recent drivers enumerate memories per DIMM, instead.
613 * When the memory controller is per rank, mem_is_per_rank is true.
614 */
615 unsigned n_layers;
616 struct edac_mc_layer *layers;
617 bool mem_is_per_rank;
618
619 /*
620 * DIMM info. Will eventually remove the entire csrows_info some day
621 */
622 unsigned tot_dimms;
623 struct dimm_info **dimms;
624
625 /*
626 * FIXME - what about controllers on other busses? - IDs must be
627 * unique. dev pointer should be sufficiently unique, but
628 * BUS:SLOT.FUNC numbers may not be unique.
629 */
630 struct device *pdev;
631 const char *mod_name;
632 const char *mod_ver;
633 const char *ctl_name;
634 const char *dev_name;
635 void *pvt_info;
636 unsigned long start_time; /* mci load start time (in jiffies) */
637
638 /*
639 * drivers shouldn't access those fields directly, as the core
640 * already handles that.
641 */
642 u32 ce_noinfo_count, ue_noinfo_count;
643 u32 ue_mc, ce_mc;
644 u32 *ce_per_layer[EDAC_MAX_LAYERS], *ue_per_layer[EDAC_MAX_LAYERS];
645
646 struct completion complete;
647
648 /* Additional top controller level attributes, but specified
649 * by the low level driver.
650 *
651 * Set by the low level driver to provide attributes at the
652 * controller level.
653 * An array of structures, NULL terminated
654 *
655 * If attributes are desired, then set to array of attributes
656 * If no attributes are desired, leave NULL
657 */
658 const struct mcidev_sysfs_attribute *mc_driver_sysfs_attributes;
659
660 /* work struct for this MC */
661 struct delayed_work work;
662
663 /* the internal state of this controller instance */
664 int op_state;
665
666 #ifdef CONFIG_EDAC_DEBUG
667 struct dentry *debugfs;
668 u8 fake_inject_layer[EDAC_MAX_LAYERS];
669 u32 fake_inject_ue;
670 u16 fake_inject_count;
671 #endif
672 __u8 csbased : 1, /* csrow-based memory controller */
673 __resv : 7;
674 };
675
676 #endif
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